“In the face of diversified demands and tight supply of raw materials, modular design can be freely matched and flexibly replaced, especially for small-scale mass-produced products, which have obvious delivery time and cost advantages.
2022 is a year full of uncertainty. Issues such as rising material prices and extended delivery times will continue to affect product delivery. How to minimize the impact from the design process? The following will take HDG2L-IOT as an example to introduce the modular design in the ARM industrial control board.
HDG2L-IOT is a cost-effective industrial control board based on Renesas RZ/G2L dual-core A55 processor. Its WIFI, Ethernet, USB, audio, 4G/5G and other parts are modularly designed. The concept is free matching and flexible replacement.
Figure 1 HDG2L-IOT
The module adopts stamp hole design, onboard Gigabit PHY, crystal oscillator and other peripheral circuits, the module design is compatible with highly integrated Ethernet transceivers such as KSZ9031, YT8521, AR8031, RTL8211, etc., in line with 10BASE-Te, 100BASE-TX and 1000BASE-T IEEE 802.3 standard, providing powerful transmit and receive functions of 10Mbps, 100Mbps or 1000Mbps.
Figure 2 Ethernet module
Stamp hole design, onboard USB HUB chip, easy to complete 4-way USB expansion, support USB hot-plug function. The HUB chip in the module can choose FE1.1, FE2.1, USB2514, USB5744, etc., and is compatible with USB2.0 and USB3.0 communication protocols.
Figure 3 USBHUB module
Wifi communication scenarios are rich and the needs are wide. The WIFI module compatible with USB interface and SDIO interface is designed here, which can cover most of the common WIFI modules on the market. For Bluetooth & WIFI integrated module, 2.4G & 5G Wifi module can be easily adapted.
HDG2L-IOT adopts the compatible design of high-speed USB communication interface such as RTL8723, RTL8821, RTL8188, and can choose single WIFI, WiFi+Bluetooth integrated module.
Figure 4 WIFI module
The main IC in the audio section is the WM8960, which is a low-power stereo codec that uses a class-D speaker driver to deliver 1 W per channel at an 8 W load. The module adopts a stamp hole design and integrates a complete microphone interface and stereo headphone driver. In addition, the audio chip with the same type of function also has TLV320, which can be modularized and replaced.
Figure 5 Audio module
5G/4G interface module
At present, most of the pluggable 4G modules on the market have MiniPCIE interfaces, and most of the pluggable 5G modules have M.2 interfaces (with fewer MiniPCIE interfaces). In order to flexibly select 5G or 4G modules according to different application requirements, M.2 and MiniPCIE compatible interface boards are designed here.
Figure 6 5G/4G interface module
Summary: In the face of diverse needs and tight supply of raw materials, modular design can be freely matched and flexibly replaced, especially for small-scale mass-produced products, which have obvious delivery time and cost advantages.