Hybrid FPC-to-board connector combines low-profile with high-current capacity

Hirose has developed a hybrid FPC to board connector the provides significant space savings and high power capability. The low-profile BK13C Series has a pitch of only 0.35mm, stacking height of 0.6mm, and width of 1.9mm, facilitating OEMs to decrease the size and cost of portable and wearable electronic devices. The hybrid series’ power contacts support up to 5A, while the signal contacts support 0.3A.

Featuring a rugged moulded housing covered by a metal shell, the series’ fully armoured design stops housing damage when mating. The connector design efficiently utilises end spacing to increase the self-alignment range when mating. Easy mating is accomplished by a wide self-alignment range of ±0.22mm in the pitch direction and ±0.3mm in the width direction. The insert moulded header and receptacle removes gaps between the terminals and housing, stopping solder wicking.

The hybrid series connector is commonly employed for portable devices like audio players, cameras, laptops and gaming consoles, and wearable devices like earbuds, smartwatches and smart glasses.

“Based on customer demand, the hybrid BK13C Series offers enhanced capabilities that enable portable and wearable devices to be smaller and lighter,” said Mark Kojak, VP of sales and marketing for Hirose Electric USA. “The power contact design reduces the length of the connector by 43% over conventional designs.”

The series has a rated voltage of 30VAC/DC and an operating temperature of -55C to +85C.

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